JPS6245719B2 - - Google Patents
Info
- Publication number
- JPS6245719B2 JPS6245719B2 JP5809480A JP5809480A JPS6245719B2 JP S6245719 B2 JPS6245719 B2 JP S6245719B2 JP 5809480 A JP5809480 A JP 5809480A JP 5809480 A JP5809480 A JP 5809480A JP S6245719 B2 JPS6245719 B2 JP S6245719B2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- aluminum plate
- conductive circuit
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5809480A JPS56155585A (en) | 1980-04-30 | 1980-04-30 | Printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5809480A JPS56155585A (en) | 1980-04-30 | 1980-04-30 | Printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56155585A JPS56155585A (en) | 1981-12-01 |
| JPS6245719B2 true JPS6245719B2 (en]) | 1987-09-28 |
Family
ID=13074356
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5809480A Granted JPS56155585A (en) | 1980-04-30 | 1980-04-30 | Printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56155585A (en]) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020045407A1 (ja) | 2018-08-28 | 2020-03-05 | 国立大学法人 奈良先端科学技術大学院大学 | 繊維用撥水撥油剤及び繊維製品 |
| KR20230103974A (ko) * | 2021-12-30 | 2023-07-07 | 파이쳄 코포레이션 | 차광용 조성물 및 이의 제조 방법, 디스프레이 장치 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58124985U (ja) * | 1982-02-16 | 1983-08-25 | 住友電気工業株式会社 | プリント基板 |
-
1980
- 1980-04-30 JP JP5809480A patent/JPS56155585A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020045407A1 (ja) | 2018-08-28 | 2020-03-05 | 国立大学法人 奈良先端科学技術大学院大学 | 繊維用撥水撥油剤及び繊維製品 |
| KR20210032448A (ko) | 2018-08-28 | 2021-03-24 | 고쿠리츠다이가쿠호징 나라 센탄카가쿠기쥬츠 다이가쿠인 다이가쿠 | 섬유용 발수 발유제 및 섬유 제품 |
| KR20230103974A (ko) * | 2021-12-30 | 2023-07-07 | 파이쳄 코포레이션 | 차광용 조성물 및 이의 제조 방법, 디스프레이 장치 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56155585A (en) | 1981-12-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6518514B2 (en) | Circuit board and production of the same | |
| US20070010086A1 (en) | Circuit board with a through hole wire and manufacturing method thereof | |
| US5079065A (en) | Printed-circuit substrate and method of making thereof | |
| KR100747022B1 (ko) | 임베디드 인쇄회로기판 및 그 제작방법 | |
| US4243474A (en) | Process of producing a printed wiring board | |
| JP3167840B2 (ja) | 印刷配線板および印刷配線板の製造方法 | |
| JPS6245719B2 (en]) | ||
| JPH1070363A (ja) | 印刷配線板の製造方法 | |
| KR100648971B1 (ko) | 임베디드 인쇄회로기판의 제조방법 | |
| JPH08264939A (ja) | 印刷配線板の製造方法 | |
| JP3780535B2 (ja) | プリント配線板の製造方法 | |
| JP3329699B2 (ja) | 多層配線板およびその製造方法 | |
| JPS5910770Y2 (ja) | プリント配線板 | |
| JPH0446479B2 (en]) | ||
| JPS60236280A (ja) | 配線用板 | |
| JPS62114247A (ja) | 電子素子用チツプキヤリアの製造法 | |
| JPS60236279A (ja) | 配線用板 | |
| JPS60236278A (ja) | 配線用板 | |
| JPS63246897A (ja) | 金属ベ−ス２層配線板の製造法 | |
| JP4019717B2 (ja) | 部品内蔵多層配線モジュール基板及びその製造方法 | |
| JP2003060354A (ja) | 部品内蔵プリント回路板及びその製造方法 | |
| JPH1146056A (ja) | 電子部品装置 | |
| JP4126753B2 (ja) | 多層板 | |
| JP4285215B2 (ja) | 両面銅張積層板及びその製造方法並びに多層積層板 | |
| JP2514384Y2 (ja) | 金属ベ―ス配線板 |